Name: PC FR HS
SKU: 1148
Availability: InStock

PC FR HS

$40.00

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4 Rolls — 25% OFF

6 Rolls — 30% OFF

10 Rolls — 35% OFF

As low as $12.99 per roll.

Product Features

Revolutionary Ultra-Thin Flame-Retardant Technology
Stunning Transparency & Adjustable Light Diffusion
Excellent Layer Adhesion & Impact Resistance
Automatic Feeding System Compatible
High Strength & High-Speed Printing up to 350 mm/s
Diameter: 1.75mm +/- 0.03mm

Cautions for Use

All Sizes for Nozzle
All Materials for Nozzle
Mandatory Dry Out Before Use
Enclosed Printer Strongly Recommended
Full AMS/CFS Compatibility
Store Sealed with Desiccant

Shield-2

Clear

SKU: N/A Category: PC

Order Info

Free shipping on orders over $89
Free shipping on orders over $199 to remote areas including Alaska, Hawaii, Puerto Rico, Guam, Northern Mariana Islands and American Samoa. See our Shipping Policy for details.

IPCON PC FR HS: Flame-Retardant PC Filament
Ultra-Thin for High-Speed Performance

IPCON PC FR HS is a high-performance polycarbonate filament engineered for safety and speed. It achieves UL 94 V-0 flame resistance at an ultra-thin 0.8mm while enabling print speeds up to 350mm/s. This material combines adjustable optical clarity with industrial-grade strength, offering a balanced desktop 3D printing solution for demanding applications.

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Stunning Transparency
Worry-Free Flame Resistance

By flexibly controlling print thickness (starting from 0.4 mm) and printing speed, the light transmittance can be intelligently adjusted, easily achieving visual effects ranging from semi‑transparency and soft light diffusion to solid colors. Combined with seven selected traditional Chinese colors — Dark Cyan, Milky White, Reed Grey, Golden Red, Navy Blue, Nature, and Pomegranate Red — it perfectly suits “aesthetic‑driven” artistic home designs such as lampshades, candle holders, and ashtrays.

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Revolutionary Ultra-thin Flame-retardant Technology

The world’s first 0.8mm ultra-thin, UL94 V-0 rated translucent flame-retardant PC filament far surpasses the industry’s standard 3.2mm opaque V-0 flame-retardant grade. It balances “thin transparency” with “safety,” is halogen-free, PFAS-free, and certified by the internationally recognized authority SGS. It ideally meets the top-level flame-retardancy and increasingly stringent environmental compliance requirements of consumer electronics such as smart lighting, power banks, network patch panels, and computer drive-bay enclosures.

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Strong & Reliable
Steady & Assuring

IPCON PC FR HS far surpasses translucent PETG and PLA in strength, toughness, and heat resistance, with an XY flexural strength exceeding 100 MPa and an impact toughness of up to 62.6 kJ/m². The printed parts offer enhanced load-bearing and impact resistance, easily meeting the demands of high-strength, heat-resistant components such as outdoor stove tripods.

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Industrial-Grade Strength
Maker-Level Friendly

IPCON PC FR HS addresses material thermal shrinkage, eliminating “edge warping.” Even entry-level printers like the Bambu Lab A1 can effortlessly handle large-scale models when adhesive is applied. Interlayer strength is enhanced by over 40% compared to competing products, significantly minimizing brittle cracking.

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Filament Performance Comparison Table

Item	IPCON PC FR HS*	Bambu PC	Bambu PC FR	Bambu Translucent PETG	Bambu Translucent PLA
Strength (Flexural Strength-XY)	101 MPa	108 MPa	90 MPa	68 MPa	85 MPa
Layer Strength (Flexural Strength-Z)	75 MPa	55 MPa	47 MPa	55 MPa	42 MPa
Stiffness (Flexural Modulus-XY)	2521 MPa	2310 MPa	1890 MPa	1610 MPa	3000 MPa
Layer Stiffness (Flexural Modulus-Z)	2754 MPa	1620 MPa	1660 MPa	1520 MPa	2650 MPa
Toughness (Impact Strength-XY)	62.6 kJ/m²	38.4 kJ/m²	55.0 kJ/m²	37.4 kJ/m²	18.5 kJ/m²
Layer Adhesion(Impact Strength-Z)	11.2 kJ/m²	9.0 kJ/m²	8.0 kJ/m²	7.2 kJ/m²	8.5 kJ/m²
Heat Resistance (HDT @ 0.45 MPa)	92 °C	117 °C	113 °C	74 °C	60 °C
Saturated Water Absorption	0.28%	0.25%	0.12%	0.30%	0.34%
Max Printing Speed	350 mm/s	300 mm/s	300 mm/s	220 mm/s	150 mm/s

*The mechanical properties were tested on specimens printed by IPCON using a Bambu Lab P1S printer, 0.4 mm nozzle (Nozzle Temp: 255 °C; Bed Temp: 90 °C; Print Speed: XY-240 mm/s, Z-100 mm/s; Infill Density: 100%; Infill Pattern: Concentric), PC FR HS (Navy Blue) filament. Data is for user reference and comparison only. Bambu Lab data sourced from their TDS.

Extreme Speed, Maximum Efficiency

IPCON PC FR HS precisely controls material rheological properties (low-temperature flowability + rapid cooling), optimized for hyper-speed printing — capable of up to 350 mm/s in tests with Bambu Lab P1S. Compatible with AMS and other automatic feeding systems for continuous filament change, enabling rapid prototyping that helps hobbyists save time and enterprise users boost productivity.

Compatibility

Printer Type	Enclosed (Rec.), Open-frame
Nozzle Material	All materials
Nozzle Size	All sizes
Print Bed Type	Smooth PEI (Rec.) /Textured PEI
Support Material	Itself or Support for PC
Compatible glue	Liquid glue or IPCON solid glue stick
AMS or CFS	Compatible

Printing Guide

Parameter	Setting
Pre-Dry Conditions	65-75 ℃, 8-12 h (Convection Oven)
Nozzle temperature	240-270 ℃
Bed temperature	85-100 ℃
Cooling fan	0 %-60 %
Printing Environment	≤ 60 ℃, ≤ 20 % RH (Sealed with Desiccant)
Storage environment	≤ 35 ℃, ≤ 20 % RH (Sealed with Desiccant)
Printing speed	Up to 350 mm/s

IPCON PC FR HS is now officially available, featuring a patented paper spool and eco-friendly paper box packaging—complete with protective bubble wrap, a reusable aluminum foil bag, a label, and desiccant—all designed to ensure premium quality and support sustainability. Stay connected with our latest updates and innovations by following IPCON on social media, and be sure to explore our new filament with a convenient 250g trial size.

*The color and texture of the filament are subject to the physical product. Images are for reference only.

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Key Notes

High-Speed Printing: Supports up to 350 mm/s with nozzle temperature 240–270 ℃. Minor stringing in travel moves can be removed by hand or with a heat gun.
Filament & Adhesion: Avoid sharp bends in filament path to prevent stress fracture. Apply dedicated liquid glue or IPCON solid adhesive stick to the build plate before printing to ensure adhesion and prevent warping.
Drying & Storage: Use directly if sealed (pre-dried before shipping). Otherwise, dry at 65–75 ℃ for 8–12 h. During printing, keep filament sealed with desiccant (≤60 ℃, ≤20% RH).

PC FR HS Filament Printing Guide

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Talk to an expert

I need a flexible filament for parts that need to bend. What do you suggest?

Sure! For parts that need to bend, try TPU Filament. It’s flexible, durable, and perfect for phone cases, grips, seals, toys, and more.

How should I store my filaments to prevent moisture absorption?

For short-term: Keep spools in a sealed bag with the included desiccant packet. For long-term: Store in an airtight container with silica gel packets. If your filament is brittle or makes popping sounds, it’s wet and needs to be dried.

What payment methods do you accept?

We accept Visa, MasterCard, Meta Pay, Diners Club, Discover, Shop Pay, Apple Pay, Google Pay, American Express. All payments are secure.

Can I change my order after it’s been placed?

Yes, you can quickly make changes to your recent order directly through your account on our website.

My tracking shows delivered, but I don’t have it?

Don’t worry, this sometimes happens. Your order will likely arrive in 1-2 days. Check our Tracking Page for notes/photos. Ask neighbors and check all possible drop-off spots. Contact the shipping carrier for more specific details. If it still doesn’t show up, please contact our Customer Support team within 14 days of the last tracking update, with your order number and tracking information.

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PC FR HS

IPCON PC FR HS: Flame-Retardant PC Filament
Ultra-Thin for High-Speed Performance

Stunning Transparency
Worry-Free Flame Resistance

Revolutionary Ultra-thin Flame-retardant Technology

Strong & Reliable
Steady & Assuring